Ag Conductive Pastes
Excellent adhesion and reliability on substrates including aluminum nitride (AlN). Firing temperatures from 600°C to 900°C.
Electronic Materials
Products
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Cu Conductive Pastes
Excellent adhesion and reliability on substrates including aluminum nitride (AlN). Firing temperatures from 600°C to 900°C.
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CuAgTi Active metal pastes
Strong bonding to ceramic substrates, including silicon nitride (Si₃N₄). Suitable for ultra-thick conductive films.
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Glass pastes
Forms heat-resistant protective layers for 300°C to 400°C applications. Helps prevent oxidation of resistive elements.
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CuNi Resistive Pastes
Suitable for resistance ranges from 1 Ω to 10 Ω. Ideal for current sensing and power management chip resistors.
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LaB6 Resistive Pastes
Suitable for resistance ranges from 3 Ω to 1,000 Ω. Provides high accuracy and reliability at medium to high resistance values.
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MDot™ Silver Nano Filler for Conductive Silver Pastes
Functions as a sintering aid for conductive pastes, enabling lower resistivity and higher thermal conductivity through low-temperature processing.
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MDot™ Conductive Silver Pastes and Inks for Printed Electronics
Enables low-temperature printed and inkjet-printed circuit formation with excellent electrical conductivity.
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MDot™ Conductive Silver Pastes for Passive Components
Thermosetting conductive silver pastes for conductive polymer tantalum capacitors, suitable for electrode formation and lead frame bonding.
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MDot™ Silver Sintering Pastes for Die Attachment
Enables low-temperature sintering with high thermal conductivity and excellent bonding reliability for semiconductor die attachment.
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Heat Press Cushioning Material （Fluororesin-impregnated Glass Cloth）
Excellent heat resistance and release properties. Helps ensure stable press molding and easy release.
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Heat Press Cushioning Material （Aramid Fiber Cloth）
High strength and excellent wear resistance. Conforms to surface irregularities for uniform pressure distribution.
