
Ag Conductive Pastes
Excellent adhesion and reliability on substrates including aluminum nitride (AlN). Firing temperatures from 600°C to 900°C.

Excellent adhesion and reliability on substrates including aluminum nitride (AlN). Firing temperatures from 600°C to 900°C.

Excellent adhesion and reliability on substrates including aluminum nitride (AlN). Firing temperatures from 600°C to 900°C.

Strong bonding to ceramic substrates, including silicon nitride (Si₃N₄). Suitable for ultra-thick conductive films.

Forms heat-resistant protective layers for 300°C to 400°C applications. Helps prevent oxidation of resistive elements.

Suitable for resistance ranges from 1 Ω to 10 Ω. Ideal for current sensing and power management chip resistors.

Suitable for resistance ranges from 3 Ω to 1,000 Ω. Provides high accuracy and reliability at medium to high resistance values.