High-temperature Firing Pastes

Glass pastes

These Glass Pastes are highly heat-resistant protective coating materials designed for thick-film processes.

They are highly compatible with our copper pastes and resistive pastes, providing stable adhesion and uniform film quality.

The formed glass protective film securely covers the electrode layer and the resistance layer, and prevents oxygen and moisture from entering, thereby suppressing oxidation degradation of the conductor and resistor for a long time.

Even in applications where resistive elements are exposed to temperatures of 300°C to 400°C, such as ceramic heaters, these materials deliver excellent reliability by minimizing cracking, delamination, and property changes.

Catalog

Product Details

Features

Low Residue Formation Under Nitrogen Atmospheres
A clean and uniform protective film can be formed with very little residue during firing and minimal soot even under a nitrogen atmosphere.

Specification

Type	Viscosity (10 rpm) (Pa·s)	Coverage (cm²/g)	Substrates	Insulation withstand Voltage	Recommended Firing Conditions	Coefficient of Thermal Expansion
OCG12	50～100	210	Al₂O₃	≧1.5kV/t=100μm	900℃, 10min, in N₂	4.5 ppm/k
OCG17	200～300	230	Al₂O₃	≧2.5kV/t=100μm	900℃, 10min, in Air	5.8 ppm/k
OCG04	200～300	220	AlN	≧2.0kV/t=100μm	900℃, 10min, in Air	3.2 ppm/k

Application Example

- Current Sensing Chip Resistors
- Power Management Chip Resistors
- Ceramic Heaters
- Other Ceramic Circuit Substrates with Resistive Elements

Product Introduction Video

Glass Pastes

Caution

Please check the Material Safety Data Sheet (SDS) for each product.