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High-temperature Firing Pastes

Cu Conductive Pastes

  • Cu Conductive Pastesサムネイル1
  • Cu Conductive Pastesサムネイル1

By screen printing on ceramic substrates and applying an appropriate firing process, highly reliable conductive films with excellent adhesion and conductivity can be formed.

We also offers contract services for screen printing and firing processes. We can handle not only the supply of paste but also processing.

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Product Details

Features

  • Wide Firing Temperature Range
    Compatible with firing temperatures ranging from 600°C to 900°C, enabling use under a wide variety of process conditions.

    Compliance with Environmental Regulations
    Lead-free formulations compliant with RoHS, SVHC, and REACH requirements, providing excellent environmental performance.

    Viscosity Adjustment and Cofiring Compatibility
    Viscosity can be adjusted to meet specific printing requirements and process conditions. Cofiring-compatible formulations are also available for integrated firing processes with ceramic substrates.

Specification

Type Viscosity
(10 rpm)
(Pa·s)		 Coverage
(cm²/g)		 Substrates Recommended firing conditions Remarks
DC014E 100～300 70 Al₂O₃ 900℃, 10min, in N₂ -
AMR03 200～400 90 Al₂O₃, Glass 650℃, 10min, in N₂ For low-temperature firing
M22 200～400 70 AlN 900℃, 10min, in N₂ -
M29 200～400 10 AlN 900℃, 10min, in N₂ Applicable for fired film thickness starting from 7μm
DC014GL 50～100 65 - 900℃, 10min, in N₂ Does not contain adhesion components.
GL19 50～100 70 - 650℃, 10min, in N₂ Does not contain adhesion components; suitable for low-temperature firing.

Application Example

    • Wiring Formation for LED Package Substrates (Alumina (Al₂O₃))
    • Wiring Formation for Passive Components (Aluminum Nitride (AlN))
    • Ceramic Heaters

Product Introduction Video

  • Cu Conductive Pastes

Caution

  • It should be fired in a nitrogen atmosphere.
  • Please check the Material Safety Data Sheet (SDS) for each product.