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High-temperature Firing Pastes

Ag Conductive Pastes

  • Ag Conductive Pastesサムネイル1
  • Ag Conductive Pastesサムネイル1

Our Ag conductive pastes provide excellent adhesion and reliability not only on alumina (Al₂O₃) and glass substrates, but also on aluminum nitride (AlN) substrates, which are generally considered difficult to bond to.

They supports various application methods such as screen printing, screen offset printing and dip coating, and provides paste optimized for each method.

Customization is also available to meet specific application requirements. Please feel free to contact us for further information.

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Product Details

Features

Wide Firing Temperature Range
Compatible with firing temperatures ranging from 600°C to 900°C, enabling use under a wide variety of process conditions.

Compliance with Environmental Regulations
Lead-free formulations compliant with RoHS, SVHC, and REACH requirements, providing excellent environmental performance.

Customizable Viscosity
Viscosity can be tailored to application requirements, optimizing printability and process performance.

Lineup Available for High-temperature Applications
Products for high-temperature conditions such as ceramic heater heating elements are also available.

Excellent Adhesion Reliability
Maintains adhesion strength of 2 kgf/2 mm2 even after 1000 cycles of thermal cycling test .

  • <small>・After silver paste plating <br>・Thermal cycle test : -45℃⇔125℃ <br>・Dstruction mode : in-solder destruction / substrate gougin</small>

    ・After silver paste plating
    ・Thermal cycle test : -45℃⇔125℃
    ・Dstruction mode : in-solder destruction / substrate gougin

  • <small>・After silver paste plating<br> ・Thermal cycle test : -45℃⇔125℃<br> ・Fracture mode : interfacial detachment</small>

    ・After silver paste plating
    ・Thermal cycle test : -45℃⇔125℃
    ・Fracture mode : interfacial detachment

Specification

Type Viscosity
(25 rpm)
(Pa·s)		 Coverage
(cm²/g)		 Substrates Recommended firing conditions Remarks
HS301 100～200 230 Al₂O₃, Glass ≧600℃, 10min -
HS301CS 100～200 240 Al₂O₃ ≧850℃, 10min Migration-resistant
HS201 50～150 190 AlN ≧850℃, 10min -
HS002CB 150～250 190 - ≧850℃, 10min Migration-resistant
HS107D5 2～10 250 Al₂O₃ ≧850℃, 10min For dipping
HS101T2 10～30 250 Al₂O₃ ≧850℃, 10min For screen and pad printing, Migration-resistant
High-resistance type 100～300 - Al₂O₃, AlN 850℃, 10min For forming heating elements in heaters, Adjustable from 3mΩ/□ to 40mΩ/□

Application Example

    • Wiring Formation for LED Package Substrates (Alumina (Al₂O₃))
    • Wiring Formation for Passive Components (Aluminum Nitride (AlN))
    • Ceramic Heaters

Product Introduction Video

  • Ag Conductive Pastes

Caution

  • The listed data represents typical values and does not guarantee performance or quality.
  • Product specifications are subject to change without notice.