MDot™ Series -Silver Nanoparticle Applied Products
MDot™ Silver Nano Filler for Conductive Silver Pastes
Product Details
Features
Promotes Low-Temperature Sintering
Sintering readily progresses even at temperatures below 200°C, enabling lower resistivity and higher thermal conductivity in low-temperature processes that are difficult to achieve with conventional pastes.
Excellent Dispersion Stability
Our unique particle surface control technology enables silver nanoparticles, which generally tend to aggregate, to be stably dispersed in solvents for an extended period.
Contributes to High-Density Sintered Layers
By filling the spaces between larger Ag fillers , the silver nanoparticles contribute to the formation of a dense sintered structure.
Specification
| Series | Silver Content | Particle Size (DLS) | Characteristics |
|---|---|---|---|
| CF3XX | ≦90wt% | 70～100nm | General Purpose (Suitable for a Wide Range of Conductive Pastes) |
| CF4XX | ≦90wt% | 130～170nm | For Die Attachment Pastes / Low Organic Content / Large Particle Size |
| CF6DXX | ≦92wt% | 60～90nm | For Die Attachment Pastes / Low Organic Content / Excellent Sintering Performance under N₂ Atmosphere |
| SP15XX | ≦87wt% | 30～50nm | Conductive Additive for Inkjet Inks and Rechargeable Battery Electrodes |
Supplied as pastes or slurries dispersed in solvents. Product codes (indicated by “xx”) vary depending on the dispersion solvent used.
Examples of solvents that have been dispersed :
Ethyl Carbitol, Butyl Carbitol Acetate, Butyl Carbitol, Terpineol, Isophorone, Dihydroterpineol, Liquid Epoxy, Acrylate Monomer, Carbitol Acetate Application
Application Example
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- Conductive Pastes for Wiring Formation
- Conductive Adhesives
- Die Attachment Pastes
- Conductive Pastes for Internal Electrode Formation in Passive Components
Caution
To ensure dispersion stability and quality stability, Ag Nano Filler MDot™ will be provided in a state of dispersion in a solvent.