Thick Film Solutions

Thick Film Printed Cu Substrate (TPC)

By screen printing our copper pastes onto various substrates, including ceramic substrates, thick-film copper patterns can be formed.

The design flexibility of the printing pattern also enables the formation of stepped structures, making it possible to achieve copper thicknesses suitable for power device applications.

Furthermore, the bonding reliability to various ceramic substrates is comparable to that of AMB (Active Metal Brazed) substrates, providing excellent durability and long-term stability.

Catalog

Product Details

Features

Compatible with Various Substrates
Compatible with a wide range of ceramic substrates, including silicon nitride (Si₃N₄), aluminum nitride (AlN), sapphire, and alumina (Al₂O₃).
By utilizing copper paste lamination technology based on the screen-printing process, uniform and stable thick-film copper wiring can be formed even on high-hardness, highly insulating ceramic substrates that are difficult to process using conventional direct bonding technologies.

Flexible Thickness Control
The lamination of copper paste by screen printing enables stepwise control of copper thickness through mask design and optimization of the number of printing cycles, allowing stepped structures to be formed with ease.

Specification

		Reference Standard	Remarks
Base material	Material	AlN, Al₂O₃, Si₃N₄	Other materials on request
	Size	50～114 mm	-
	Thickness	0.2 mm	-
Conductive property	L/S	≧300 / 300 μ	-
	Film thickness	30～100 μ	100μ or more on request
	Resistivity	2.5～5.0 μΩcm	-
	Adhesion before plating	≧3.0 kgf / 2mm²	Measured by peel test
	Adhesion after plating	≧2.5 kgf / 2mm²	Measured by peel test

Application Example

Ceramic heat dissipation circuit packages for power devices, etc.