MDot™ Series -Silver Nanoparticle Applied Products

MDot™ Silver Sintering Pastes for Die Attachment

This is a sintering paste for semiconductor bonding that can be sintered at low temperatures and offers both high thermal conductivity and bonding reliability.

It can form a metal sintered layer that is resistant to deterioration even under high-temperature operating conditions where conventional solder materials are difficult to use, making it widely applicable in semiconductor packaging fields that demand high strength, high thermal conductivity, and high reliability.

Catalog

Product Details

Features

High Density and High Thermal Conductivity
Proprietary silver nanoparticles enable the formation of dense sintered layers with minimal voids, resulting in excellent thermal conductivity.

Low-Temperature Sintering
Can be used in low temperature processes above 200°C.

Cross-section: Pressure-less bonding
Cross-section: Pressure bonding

Specification

Pressure-less Bonding

Type	Resistivity	Sintering Condition	DSS (Die Shear Strength)	Thermal Conductivity	Applications
S320	<3.5 μΩ·cm	50℃, 30～90 min ＋200～250℃, 60 min	80 MPa	>200 W/m·K	Die Attachment for Power Devices, RF Devices, LEDs, and Laser Diodes

Pressure Bonding

Type	Resistivity	Sintering Condition	DSS (Die Shear Strength)	Thermal Conductivity	Applications
S280	<3 μΩ·cm	>10Mpa,250~300℃,2min	100 MPa (300℃,10Mpa,2min)	>250 W/m·K	Power Devices (Die Attachment)
S290	<3 μΩ·cm	>10Mpa,250~300℃,2min	100 MPa (300℃,10Mpa,2min)	>250 W/m·K	Power Devices (Module Assembly)

Application Example

Caution

The listed data represents typical values and does not guarantee performance or quality.
Product specifications are subject to change without notice.