CUX™ Copper Sintering Paste for Die Attachment
CUX™ Copper Sintering Paste for Die Attachment
Product Details
Features
Bonding Under Inert Gas (N₂) or Vacuum Conditions
Bonding can be performed under nitrogen atmospheres or vacuum conditions without requiring reducing atmospheres such as hydrogen or formic acid. This contributes to process simplification and improved operational safety.
Low-Temperature Sintering
Can be used in low temperature process of 230°C.
High Bonding Reliability
Demonstrates excellent bonding reliability under the following evaluation conditions:
・Solid copper substrate: 18 mm × 18 mm
・Solid copper chip: 3 mm × 3 mm
・Without resin molding
・-55°C ↔ 150°C(Keep at low temperature and high temperature for 30 minutes each.)
-
-
Sintering conditions：100℃, 10min, Air → 260℃, 10MPa, 5min, N₂
Specification
| Type |
Resistivity
|
DSS (Die Shear Strength)
|
Thermal Conductivity
|
Sintering Conditions
|
Applications
|
|---|---|---|---|---|---|
| Y001 | <6μΩ·cm | >30 MPa (230℃, 10MPa, 5min, N₂) | >250 W/m·K | >10MPa, ≧230℃, >5min |
Power devices (Die attach)
|
Application Example
For power semiconductor die-attaching and semiconductor module attaching
Caution
- The listed data represents typical values and does not guarantee performance or quality.
- Product specifications are subject to change without notice.