Silver/Silver Nanoparticle Applied Products (Pastes, Inks, Slurries)

Silver nano filler MDot™ for conductive silver pastes

Ag nano filler MDot™ is a silver nanoparticle dispersion produced using our proprietary manufacturing process. It has superior low-temperature sinterability and functions as a sintering aid for various conductive pastes, such as wiring/electrode formation and die attachment, which require low resistance and high thermal conductivity at temperatures of 200°C or less.

Catalog

Product Details

Features

It has high dispersion stability and can be supplied as a paste or slurry that has been dispersed at high concentrations in various polar solvent liquids.
We have a proven track record of mass production that supports our reputation for quality.
There is a lineup of particle sizes that match the applications.
With low-tempetature sintering properties, the silver nanoparticles begin to fuse at 80-100℃, resulting in conductivity.

Achievement

Examples of solvents with dispersion results

Ethyl carbitol
Butyl carbitol acetate
Butyl carbitol
Terpineol
Isophorone
Dihydroterpineol
Liquid epoxy
Acrylate monomer
Carbitol acetate

Practical examples of customer products that contain MDot™

Conductive paste for wiring formation
Conductive adhesive
Die attach paste
Conductive paste for forming internal terminal electrodes of passive components

Specification

Series	Silver content	Average diameter	Feature
CF3XX	≦90wt%	70-100nm	Widely applicable for conductive paste
CF4XX	≦90wt%	100-140nm	Low organic content / Large diameter
CF7XX	≦90wt%	90-120nm	For high thermal die attach paste
CF01BC	80-85wt%	90-130nm	Standard grade / Dispersed in Butyl carbitol
SP15XX	≦87wt%	30-50nm	Inkjet ink / Conductive additive for secondary batteries

Caution

To ensure dispersion stability and quality stability, Ag Nano Filler MDot™ will be provided in a state of dispersion in a solvent.