Electronic Materials and Coating Materials
Glossary

Firing is performed by filling the kiln with nitrogen. Generally, copper paste is fired in this way because copper is oxidized when fired in air.

It is an abbreviation for AMB (Active Matal Brazing) and AMC (Active Metal brazed Copper). It refers to a substrate in which ceramics and a copper circuit board are bonded together via a brazing material.

Abbreviation for Direct Bonded Copper, a ceramic insulating substrate with a copper circuit.

This is a method of bonding by melting an alloy with a lower melting point than the object to be bonded by heating. Although this is essentially physical bonding, in the case of bonding active metal paste and nitrogen compounds, the chemical reaction that occurs during melting makes it possible to achieve stronger adhesion than physical bonding.

This is a metal paste containing active metals (Ti, Sn). Conventional metal pastes adhere to the substrate due to the glass component in the mixture, but this paste enables stronger adhesion by chemically bonding the active metal with the adherend (containing nitrogen).

Abbreviation for equivalent series resistance, which is the series resistance component present in a capacitor.

It is a characteristic that the smaller the size of the metal particles, the lower the melting point. This is especially observed in nanoparticles with sizes of several tens of nanometers or less.

Silver in nanoparticle size. Normally, it is difficult for particles to exist as nanoparticles because the smaller they are, the more they aggregate, but our technology makes it possible to use them as nanoparticles.

As the name suggests, it is an adhesive with conductive properties. It is mainly used for bonding electronic components and chips. Compared to solder, it can be bonded at lower temperatures.

It is the force applied when an upward force is applied and pulled away from the substrate/die. The strength is measured by joining wires.

It is the force (peeling strength) per unit area (width) that peels off the conductor pattern of a substrate, and is also referred to as peeling strength.

Abbreviation for Binder Burnout, which refers to the decomposition of the binder (organic content of the paste) by firing.

A liquid component that serves as a medium for evenly dispersing and adhering pigments and additives.

This refers to heating ceramics, metals, etc. at high temperatures below their melting points to change their strength and properties.

It is a phenomenon in which ions of a conductor metal migrate due to the influence of electricity flowing through the metal conductor, resulting in defects in the conductor section.

It refers to the resistance to sulfurization with sulfur components present in the air, etc. Copper is particularly resistant to sulfurization.

Additive to improve and stabilize sintering properties. It enters between particles and fills in the gaps to promote densification.

It is the solid portion (non-volatile component) of a paste or adhesive, excluding volatile substances such as water and solvents.

It represents the inherent electrical resistance of a substance.

This is the Temperature Coefficient Resistance. The temperature coefficient of resistance is a coefficient that expresses the rate of change in the resistance value of a resistive paste as the temperature changes.

A firing furnace in which multiple firing conditions are continuously passed through the furnace by means of a mesh belt, etc.

It is a liquid emulsion of liquid chemicals that are insoluble in water and dispersed finely and homogeneously.

A jig used for printing paste on a substrate. A pattern is formed on a substrate by creating a microscopic notch pattern on a thin stainless steel plate and brushing paste onto the notch pattern.

A common plate used in screen printing methods.

A screen plate with multiple holes, called a screen plate, is placed on a substrate, and paste is further printed on top of it to form a specific shape on the substrate.

This is the process of polishing the surface of the via filling area until there are almost no irregularities. Polishing the entire substrate after via filling further improves the smoothness of the filled area. Mirror Polishing is superior in smoothness, and lapping polishing is superior in cost performance.

Cu paste is poured into multiple holes (vias) in a ceramic substrate to fill them. We fill them by printing Cu paste on the substrate.

This is a non-continuous firing furnace in which a fixed number of items are heated in the furnace.

Cushioning materials are used in the multi-stage pressing process during the manufacture of copper-clad laminated substrates. High durability is required because pressing is performed under high temperature and high pressure conditions.Cushioning materials are used in the multi-stage pressing process during the manufacture of copper-clad laminated substrates. High durability is required because pressing is performed under high temperature and high pressure conditions.

A colorant that does not dissolve in solvents. Compared to dyes, they have better resistance to light and heat.

A colorant that is soluble in solvents. Because they are soluble in solvents, it is relatively easy to create new colors, but colors fade when exposed to light for long periods of time.

Also called an inkjet coater, this coating method is based on the mechanism of an inkjet printer. Droplets of coating material are dispersed and applied to the object. It is characterized by its ability to apply fine patterns and low material loss.

It is a coating film that protects the outermost surface. Also called overcoat, its durability varies depending on the paint used.

The first coat of paint. It is also called base coat or primer paint. The aluminum mirror surface paint developed by our company has the feature of not requiring a primer.

It is a paint made of a compound containing synthetic resins. Because it contains resin, it has a certain degree of elasticity and is resistant to cracking.